Frohe Weihnachten !!
Das Jahr neigt sich einmal mehr dem Ende zu und die “besinnliche Zeit” beginnt.
Wir wünschen Ihnen und Ihrer Familie frohe Weihnachten und ein gesundes und glückliches neues Jahr!
Bleiben Sie gesund!
Ihr Microtronic Team
Wir machen vom 21.12.2024 bis zum 07.01.2025 Betriebsferien. In dieser Zeit ist kein Versand von Waren möglich.
Flussmittel
Flussmittel
Features:
- VOC-Free
- Halide/Halogen-Free
- ORL0 Per IPC J-STD-004B
- High SIR Performance
- Compatible with all Leaded /Lead-Free Alloys
Features:
- For use with Sn/Pb and Pb-Free alloys
- Excellent Wetting
- Wide Process Window
- Used for Ball Attach
Features:
- Rosin Activated
- Non-Corrosive Residues
- Improved Soldering Performance
- Residues Removable With a Saponifier
- Can Be Foamed, Sprayed, Dipped or Brushed
Features:
- Passes SIR in Raw State
- Low-Residue
- Extremely Safe for Rework
- Halide-Free
- Wide Process Window
- Can Be Foamed, Sprayed, Misted, or Dipped
- Excellent Wetting
- Lead-Free Compatible
- Available in Industry Standard Sizes
Features:
- Halide/Halogen-Free
- ROL0 Per IPC J-STD-004A/B
- Low Post Process Residues
- Fast Wetting with All Leaded and Lead-Free Alloys
- IPC-A-610F Compliant
- High SIR Performance
- Broad Process Window
NC263UR is a rosin-free, resin-free, halide-free, no-clean wave solder flux designed to promote enhanced wetting during the wave soldering process. NC263UR has a higher activity level and lower surface tension than other no-clean liquid fluxes. NC263UR performs well with bare copper, solder-coated, and organic coated PWBs, leaving
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