Seit 1994 vertreten wir die Firma SONIX Inc. in der EU. Mittlerweile gehört Microtronic zu einem Weltweiten Netzwerk von Sonix mit Laboren, Schulungseinrichtungen und Supportstandorten. 
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Package Inspection Applications

Image quality. Speed. Uptime. They’re all crucial. Getting all three at the same time in a nondestructive testing (NDT) solution for package inspection is the challenge. It takes continuous innovation, advancing the state of the art to keep pace with the semiconductor industry’s own exponential progress.

Sonix has been the innovation leader since 1986. Today, the ECHO line of scanning acoustic microscopes sets the standard for package inspection speed and image quality, to help you keep pace with new packaging materials and difficult form factors. The ECHO platform will remain at the forefront as we continue to add features and enhance performance for years to come.

Choose our ECHO scanning acoustic microscope for package inspection of stacked dies, complex flip chips and more traditional plastic packages. ECHO VS adds industry-leading features for the clearest imaging of Cu pillars, molded flip chip (MUF), CSP, MCM, stacked die, hybrids, and other advanced package inspection applications. The ECHO Pro adds fully automated handling for 100% package inspection in high-volume production environments.

Sonix is ISO 9001/2008 Certified. All of our tools are Semi S2/S8 certified.

ECHO VS™

The ECHO VS system adds our Image Enhancement Suite to the ECHO platform to provide industry-leading image quality and defect identification capabilities. It’s our most advanced scanning acoustic microscope for development labs and for production environments that require the highest precision.

Product Details: 

To identify the smallest and most subtle defects in leading-edge packaged microelectronic applications, ECHO VS includes standard features such as heated water for optimum acoustic coupling, Flexible TAMI for efficient capture of the most useful data, Waveform Averaging for an improved signal-to-noise ratio, ICEBERG for improved image quality and MFCI for enhanced image quality in the most demanding applications. ECHO VS is the ultimate scanning acoustic solution for molded flip chip, CSP, MCM, stacked die, MUF and other advanced packaging technologies.

• Detects air defects as thin as 0.01 micron and spatially resolves defects down to 5 microns.
• Image Enhancement Suite with heated water, waveform simulation and other innovations for industry-leading image quality in advanced packaging applications
• Image optimization for improved image quality in complex molded flip chips (MUF) and packages with polyimide layers
• Waveform averaging for improved signal-to-noise ratio
• Transducers from 15MHz through 300MHz, designed and matched in-house to address all types of applications and materials
• Stacked Die Imaging (SDI) (optional)
• Molded Flip Chip Imaging (MFCI) 

ECHO

The ECHO provides non-destructive scanning acoustic microscopy to simplify testing, increase yield and maximize productivity in the lab or on the production floor.

Product Details: 

This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.

• A robust, universal, inspection tool for overmolded single-die packages, bare flip chips and other standard applications
• Imaging of defects as small as 10 microns
• Transducers from 15MHz through 200MHz, designed and matched in-house to address all types of applications and materials
• Stacked Die Imaging (SDI) (optional)
• Molded Flip Chip Imaging (MFCI) (optional)

ECHO Pro™

ECHO Pro is a next-generation scanning acoustic microscope solution that adds fully automated JEDEC tray handling to the ECHO platform. It’s a robust, high-performance tool designed for 100% inspection and maximum throughput in high-volume, low-mix production environments.

Product Details: 

Using the reputable and reliable ECHO scanning acoustic microscope as the base system, Sonix has incorporated industry-standard SMEMA input and output handlers for easy integration into the production line. Our advanced patent pending pick-and-place gantry and drying process enable high-speed productivity with no-touch operation for 24/7 production.

• Next-generation solution with fully automated JEDEC tray handling for high-volume, low-mix production environments
• Industry-standard SMEMA input and output handlers
• Patent pending pick-and-place process designed for optimum part handling, decreased drying time and dramatically higher throughput
• Stacked Die Imaging (SDI)
• Molded Flip Chip Imaging (MFCI)

Wafer Inspection Solutions

Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.

Sonix offers a complete line of nondestructive testing (NDT) solutions optimized for finding defects and improving process control in bonded wafers including MEMS, CMOS image sensors, memory, LED, TSV(Through Silicon Via), and other demanding applications. Our AutoWafer™ and AutoWafer Pro™ systems offer full-featured wafer inspection in the development environment or on the manufacturing line, at full production speeds. Our advanced transducers and auto-analysis tools fine-tune the wafer inspection process to achieve the precise results you’re looking for.

With fully automated handling, 200mm and 300mm SECS/GEM compliance, and the options and expertise to meet your specific application requirements, Sonix is the only partner you need for semiconductor wafer quality, productivity and yield.

Autowafer Pro™: Ultrasonic Equipment for NDT of Bonded Wafers

AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.

Product Details: 

A flexible, automated wafer inspection system designed for production, AutoWafer Pro provides fast, high-resolution scanning of 200mm and 300mm bonded wafers. It’s the ideal ultrasonic equipment for identifying bond defects in wafer applications such as MEMS, BSI Sensors, CMOS, memory, TSV and LED.

With extensive analysis capabilities at both the wafer and device level, there’s no need to reload and rescan wafers to get all the diagnostic images you need. And with high-speed scanning managed by fully automated wafer handling, AutoWafer Pro supports 100% nondestructive testing (NDT) for improved yields and a faster time to market.

• The ideal ultrasonic equipment for detecting wafer-to-wafer bonding defects
• A fully automated, production-ready wafer inspection system for MEMS, CMOS, BSI sensors, memory, TSV, LED and other applications employing wafers 200mm and smaller
• Provides wafer map with die-level pass/fail indicators (optional)
• Provides analysis (optional)
• 200mm SECS/GEM
• TSV entrenched metrology
• Fast, high-resolution scanning of 200mm and 300mm wafers for production environments
• Fully automated robotics using open cassettes, SMIF Pod, FOUPs or FOSB handling
• Class 1 clean room compliant, with integrated HEPA filter
• 300mm SECS/GEM (optional)
• KLARF compatible (optional) 

Autowafer™: Automatic Ultrasonic Testing for Bonded Wafers

Installed in more wafer applications than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, production-ready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.

Product Details: 

AutoWafer is an ultrasonic wafer scanner for nondestructive testing (NDT) of wafers in development and production environments, providing high-resolution identification of bond defects in wafer applications such as MEMS, CMOS, memory, TSV and LED. Robotic cassette handling and sorting of approved and failed wafers helps speed production, while our advanced transducers and auto-analysis tools make it quick and easy to identify even the smallest, most subtle defects.

• The ideal automatic ultrasonic testing system for detecting wafer-to-wafer bonding defects
• A fully automated, production-ready wafer scanner for MEMS, CMOS, BSI sensors, memory, TSV, LED and other applications employing wafers 200mm and smaller
• Provides wafer map with die-level pass/fail indicators (optional)
• Provides analysis (optional)
• 200mm SECS/GEM
• TSV entrenched metrology

 Weitere Informationen auf der Seite http://www.sonix.com