Lotbarren - Lot in Barren
Die hochreinen Lotbarren von AIM Solder werden in verschiedenen Legierungen, Formen und Gewichten angeboten. Standard Barren haben wir immer auf Lager.
Gängige Legierungen sind: SN100C, SAC305, SAC405, SN62 & SN63.
Hier die Beschreibung von AIM Solder für Lotbarren:
Zero defect wave soldering requires consistent solder quality. Contaminants and high oxide levels in bar solder can result in wave soldering defects such as bridging, icicling, and non-wetting. In order to avoid these problems, users of bar solder are encouraged to utilize AIM’s high-purity and low drossing bar solder alloys, which are made to some of the most stringent specifications in the industry.
AIM Electropure™ Bar Solder Alloys are processed from virgin metals in a proprietary method that removes contaminants and reduces dissolved oxides to a minimum. The result of this is an extremely pure, low drossing solder bar that increases throughput and decreases defects.
AIM BAR SOLDER AT A GLANCE
- Produced from High Purity Virgin Metals
- Low Oxide Content
- Low Drossing Rate
- Reduces Defects Such as Bridging and Icicling
- Excellent Joint Strength and Aesthetics
- Fast Barrel Fill and Excellent Wetting
- Lower Surface Tension than Competitive Brands
- Available in Extruded, Cast, and Margash Bars
- Available in all Alloys, Including Tin-Lead and Lead-Free
- Compatible with all Flux Types
DROSS COMPARISON OF AIM ELECTROPURE™ AND A COMPETITIVE SN63/PB37 BAR SOLDER ALLOY
500 pounds of each type of alloy was heated in a wave solder pot at 500°F for 6 hours. The pot was de-drossed every 3 hours. After 6 hours the amount of dross generated from each type of solder was weighed. AIM’s bar solder has proven to reduce drossing as compared to competitive brands.
HIGH MELTING POINT SOLDER ALLOYS
Down hole electronics, such as oil and gas exploration, require solder alloys that have the durability to withstand the extreme thermal, geological and mechanical stresses of these applications. AIM understands system reliability is of the utmost importance, and offers a selection of high melting point solder alloys in a variety of forms which are proven to fulfill the requirements necessary for long-term reliability in solder joints.
SAC305 is a lead-free alloy that contains 96.5 % tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM’s SAC305 bar solder offers far superior fluidity as compared to other alloys and makes of bar, resulting in excellent flow. AIM’s SAC305 bar solder also produces less dross than other bar solder, wets well, provides superior joint strength, and offers superior copper dissolution rates. AIM’s SAC305 bar solder is alloyed in the proprietary Electropure™ method that results in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in the solder, thus reducing drossing, improving flow and reducing bridging during soldering. SAC305 may be used with most existing equipment, processes, coatings, and flux chemistries.
Features:
- Lowest Cost Sn/Ag/Cu Alloy
- Excellent Fatigue Resistance
- Compatible with all Flux Types
- Excellent Solder Joint Reliability
- Best Wetting Sn/Ag/Cu Alloy
Product Category:
Bars & Anodes
BEST CHOICE FOR LEAD-FREE WAVE SOLDERING
SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages is that SN100C offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy. (We are able to offer SN100C worldwide!)
SN100C AT A GLANCE
- Does not contain silver or bismuth.
- Eutectic alloy.
- Bridge-free and icicle-free soldering.
- Smooth, bright, well-formed fillets, free of gross micro-cracks, irrespective of the cooling rate.
- Good through-hole penetration.
- Good topside fillet formation.
- Dross rate equal or lower than tin-lead solder.
- Does not require a nitrogen atmosphere.
- Does not erode copper from holes, pads and tracks.
- Low rate of copper leaching makes it easy to control the copper content of the solder bath.
- Lower aggressiveness to stainless steel and other solder pot materials as compared to tin-silver-copper alloys.
- Thermal fatigue resistance and creep strength better than tin-lead.
- Slow, even growth of the intermetallic layer at the solder/substrate interface.
- Also performs well in selective and dip soldering.
THE BOTTOM LINE
Customer experience over several years is that the TOTAL cost of running a standard wave soldering machine with SN100C when all factors are taken into account can be up to one third the cost of running the same machine with tin-silver-copper alloys. The actual saving in each case will depend on the number of factors that apply, but the cost of running a line with SN100C is always lower than the cost of running the same line with tin-silver-copper.
AVAILABILITY
- Bar Solder
- Solder Bath Top-Off Alloy (SN100Ce)
- Wire Solder
- Other forms such as Solder Paste, Spheres, and Preforms.
SUCCESSFULLY TRIED AND TESTED
Leading electronics manufacturers throughout the world have used SN100C with outstanding results. To date, millions of circuit boards have been assembled with the SN100C family of solders in all types of products. Many of the devices soldered with SN100C already have been in use for several years.
SEAMLESS CHANGEOVER
AIM has already helped multitudes of manufacturers implement lead-free soldering, and we invite you to benefit from our expertise. Our services include process audits, solder pot analyses, and on-going applications support. The issue of lead-free soldering can be complex. We are here to help you from changeover right through to optimization.
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Sn63/Pb37 Electropure™ is a high purity alloy that is composed of 63% tin and 37% lead. Electropure is alloyed in a proprietary method that results in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in the solder, thus reducing drossing, improving flow, and reducing bridging during soldering. Sn63/Pb37 is a eutectic alloy with a melting point of 183°C (361°F). Typical applications are wave soldering and plating where Sn63/Pb37 is primarily used as a coating for corrosion protection, and as a base for soldering. This alloy is available in bar, solid and cored wire, foil, spheres, preforms, powder, solder paste, ingot, and anode form.
Features:
- High Purity
- Reduces Drossing
- Exceeds IPC-J-STD-006 Specifications
Product Category:
Bars & Anodes
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