NC258 LEAD-FREE & TIN/LEAD SOLDER PASTE

NC258 Solder Paste has been developed to offer long pause-to-print capabilities while enhancing fine print definitions.  NC258 Solder Paste reduces defects such as voiding and head-in-pillow.  The superior wetting ability of NC258 results in bright, smooth and shiny solder joints.  It also offers very low post process residues, which remain crystal clear even at the elevated temperatures required for today's lead-free alloys. Available in industry standard sizes. 
Features: 
Long Pause-to-Print Capabilities
Excellent Wetting, Even Leadless Devices
Enhances Fine Print Definitions 
Reduced Voiding
No Head-in-Pillow
RoHS Compliant